Industry's First Fuse Using Wetting and Dewetting Forces. The principle of operation of MNI's Fuse is fundamentally different from traditional fuses.
Chip Scale Packaging. Can be Made in 8 in Silicon Wafers to Lower Cost!
World's Only Fuse That Can be Integrated with a Control IC on the Same Substrate (Silicon)
Wetting and Dewetting Forces Ensure a Gap That is Free of Debris After Fusing Action
MNI's Fuse can be configured to protect against:
The ProStop Fuse: No Encapsulant Overpack, NO END CAPS!
The ProStop Package Less Fuse can be made as small as the market can handle for assembly MNI has made the
Lower Cost Than Competitor's Current Fuses: The smaller size of these Fuses in Flip Chip configuration on 8 inch silicon wafers allows for significant cost reduction.
Typical Size
|
MNI Size
|
Current
|
---|---|---|
1206
|
0201
|
Up to 1.75A
|
1206
|
0603
|
1.75 to 8A
|
Both the Wire-In-Air and Solid Body Fuses can be replaced by MNI's ProStop Fuse Technology With Patent Protection.
Scalability: The ProStop technology allows for fuses from milliamps to 100s of Amps to be made
Gap: 10um to 100um
Solder Ball Diameter: 130um to 760um
Large Current Fuses of 100A (Package Less) can be made using special ceramic materials and via filled connections to bottom pads that could potentially allow for the elimination of heat sinks to significantly reduce size and cost with better performance.
Patent Protection for 20 years!
MNI has received two patents. A third is in process.